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Thick 800A Plating Thickness Analyser


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The Thick800A XRF Analyser is designed for rapid and non-destructive analysis of plating layer thickness and compositions of plating and plating solutions. Some features of the Thick 800A include:

Altitude Transducer.

Si-PIN Semiconductor Detector.

Measurement of up to 5 plating layers.

Micro collimator to improve testing accuracy.

Elements:                  Na to U (more than 24 simultaneously).

Content Range:          1 ppm - 99.99%.

Repeatability:             0.1%

Long period stability:   0.1%

Dimensions:               648 x 490 x 544 mm

Sample Chamber:       517 x 352 x 150 mm

Thick 800A Specifications

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